Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/12/2006
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Application #:
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09892630
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Filing Dt:
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06/28/2001
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Publication #:
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Pub Dt:
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02/06/2003
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Inventors:
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Seigi Aoyama, Takaaki Ichikawa, Hiromitsu Kuroda, Takashi Nemoto, Atsushi Ohtake et al
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Title:
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LEAD-FREE SOLDER, AND CONNECTION LEAD AND ELECTRICAL COMPONENT USING SAID LEAD-FREE SOLDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| ALFRED A. STADNICKI |
| 1146 NINETEENTH STREET, N.W. |
| FIFTH FLOOR |
| WASHINGTON, DC 20036 |
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