Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/2004
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Application #:
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10197754
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Filing Dt:
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07/19/2002
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Publication #:
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Pub Dt:
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02/06/2003
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Inventor:
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Kazuhisa Arai
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Title:
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METHOD OF GRINDING REAR SIDE OF SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-3, HIGASHI KOJIYA 2-CHOME, OTA-KU |
| TOKYO, 144-0033, JAPAN |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| CHARLES R. WATTS |
| 2033 K STREET, N.W., SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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