Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/11/2005
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Application #:
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10203408
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Filing Dt:
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08/09/2002
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Publication #:
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Pub Dt:
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02/06/2003
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Inventors:
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Satoru Oota, Akira Nagai, Masami Yusa
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Title:
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RESIN COMPOSITION , ADHESIVE PREPARED THEREWITH FOR BONDING CIRCUIT MEMBERS,AND CIRCUIT BOARDS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKI-KU |
| TOKYO 163-0449, JAPAN |
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| ANTONELLI, TERRY, STOUT ET AL |
| WILLIAM I. SOLOMON |
| 1300 NORTH SEVENTEENTH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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