Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10165394
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Filing Dt:
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06/07/2002
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Publication #:
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Pub Dt:
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02/13/2003
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Inventors:
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Junichi Toyoda, Katsumi Okayama, Kazumasa Igarashi
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Title:
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RESIN COMPONENT FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING IT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-35, KITASHINAGAWA 6-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 141 |
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| 1-1-2, SHIMOHOZUMI |
| IBARAKI-SHI, OSAKA, JAPAN |
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| SONNENSCHEIN NATH & ROSENTHAL |
| DAVID R. METZGER |
| P.O. BOX #061080 |
| SEARS TOWER |
| CHICAGO, IL 60606-1080 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI |
| OSAKA, JAPAN |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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