Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2006
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Application #:
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10111302
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Filing Dt:
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04/23/2002
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Publication #:
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Pub Dt:
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02/13/2003
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Inventors:
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Mikihiro Ogura, Syouji Kigoshi, Masami Tokunaga, Yasuaki Tsutsumi, Ryuichi Kamei et al
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Title:
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Semiconductor joining substrate utilizing a tape with adhesive and copper-clad
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1 NIHONBASHI-MUROMACHI 2-CHOME, CHOU-KU |
| TOKYO 103-8666, JAPAN |
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| MORRISON & FOERSTER LLP |
| RAJ S. DAVE, PH.D., J.D. |
| 2000 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, D.C. 20006-1888 |
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