Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/21/2004
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Application #:
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10202698
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Filing Dt:
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07/25/2002
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Publication #:
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Pub Dt:
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02/13/2003
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Inventor:
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Mikio Takagi
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Title:
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HEATING FURNACE AND SEMICONDUCTOR WAFER-HOLDING JIG ASSEMBLY AND PROCESS OF MANUFACTURING SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2578-1, NOBORITO TAMA-KU |
| KAWASAKI-CITY, KANAGAWA, JAPAN |
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| SEC. 4, DA-AN DISTRICT |
| 11F, NO. 236, HSIN-YI RD. |
| TAIPEI CITY, TAIWAN R.O.C |
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| THOMAS, KAYDEN, HORSTEMEYER ET AL |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GA 30339-5948 |
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