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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10212857
Filing Dt:
08/06/2002
Publication #:
Pub Dt:
02/20/2003
Inventors:
Richard H. Spedden, Donald G. Bauer, Michelle D. Bryden, Paul B. Rasband et al
Title:
Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
Assignment: 1
Reel/Frame:
013449/0506Recorded: 10/29/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/17/2002
Exec Dt:
10/17/2002
Exec Dt:
10/17/2002
Exec Dt:
10/25/2002
Exec Dt:
10/17/2002
Assignee:
1 HIGH RIDGE PARK
STAMFORD, CONNECTICUT 06905
Correspondent:
WESTVACO CORPORATION
DONALD L. BOWMAN
ALFRED H. NISSAN TECHNICAL CENTER
11101 JOHNS HOPKINS ROAD
LAUREL, MD 20723
Assignment: 2
Reel/Frame:
013957/0562Recorded: 09/09/2003Pages: 7
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/31/2002
Assignee:
ONE HIGH RIDGE PARK
STAMFORD, CONNECTICUT 06905
Correspondent:
MEADWESTVACO CORPORATION
THOMAS A. BOSHINSKI, ESQ.
LAW DEPARTMENT
4850-D NORTH CHURCH LANE SE
SMYMA, GA 30080

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