Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10101774
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Filing Dt:
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03/21/2002
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Publication #:
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Pub Dt:
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03/06/2003
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Inventors:
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Kenji Komoto, Masahisa Tonegawa, Koji Murata, Masaaki Chino, Toshie Murai et al
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Title:
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Insulating resin composition for multi-layered printed circuit wiring board, multi-layerd printed circuit wiring board using the particular resin composition, and manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TAITO-KU |
| 5-1, 1-CHOME, TAITO |
| TOKYO, JAPAN |
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| CHUO-KU, OSAKA-SHI |
| 5-33, KITAHAMA 4-CHOME |
| OSAKA 541-8550, JAPAN |
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| STAAS & HALSEY LLP |
| JAMES D. HALSEY, JR. |
| 700 ELEVENTH STREET, N.W. |
| SUITE 500 |
| WASHINGTON, D.C. 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1 TAITO 1-CHOME |
| TAITO-KU |
| TOKYO 110-0016, JAPAN |
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| 5-33 KITAHAMA 4-CHOME |
| CHUO-KU, OSAKA SHI |
| OSAKA 541-8550, JAPAN |
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| STAAS & HALSEY, LLP |
| J. RANDALL BECKERS |
| 700 11TH STREET, N.W. |
| SUITE 500 |
| WASHINGTON, DC 20001 |
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