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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/23/2004
Application #:
10231881
Filing Dt:
08/30/2002
Publication #:
Pub Dt:
03/13/2003
Inventors:
Bernd Goller, Gerald Ofner, Stefan Wein, Josef Thumbs, Holger Worner et al
Title:
ELECTRONIC COMPONENT WITH AT LEAST TWO STACKED SEMICONDUCTOR CHIPS AND METHOD FOR FABRICATING THE ELECTRONIC COMPONENT
Assignment: 1
Reel/Frame:
014965/0426Recorded: 02/06/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/12/2002
Exec Dt:
09/12/2002
Exec Dt:
09/11/2002
Exec Dt:
09/16/2002
Exec Dt:
09/11/2002
Exec Dt:
09/12/2002
Exec Dt:
09/12/2002
Assignee:
ST. MARTIN-STRASSE 53
81669 MUNCHEN, GERMANY
Correspondent:
LERNER AND GREENBERG
RALPH E. LOCHER
P.O. BOX 2480
HOLLYWOOD, FL 33022
Assignment: 2
Reel/Frame:
015732/0443Recorded: 08/30/2004Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND ASSIGNOR'S NAME, DOCUMENT PREVIOUSLY RECORDED ON REEL 014965 FRAME 0426. ASSIGNOR CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
09/12/2002
Exec Dt:
09/16/2002
Exec Dt:
09/12/2002
Exec Dt:
09/16/2002
Exec Dt:
09/11/2002
Exec Dt:
09/12/2002
Exec Dt:
09/12/2002
Assignee:
ST. MARTIN-STRASSE 53
MUNCHEN, GERMANY D-81669
Correspondent:
LERNER AND GREENBEG, P.A.
P.O. BOX 2480
HOLLYWOOD, FL 33022

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