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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6671172
Issue Dt:
12/30/2003
Application #:
09950100
Filing Dt:
09/10/2001
Publication #:
20030048612
Pub Dt:
03/13/2003
Inventors:
Daniel P. Carter, Michael T. Crocker, Ben M. Broili, Tod A. Byquist, David J. Llapitan
Title:
ELECTRONIC ASSEMBLIES WITH HIGH CAPACITY CURVED FIN HEAT SINKS
Assignment: 1
Reel/Frame:
012171/0143Recorded: 09/10/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CARTER, DANIEL P.
Exec Dt:
09/06/2001
CROCKER, MICHAEL T.
Exec Dt:
09/06/2001
BROILI, BEN M.
Exec Dt:
09/06/2001
BYQUIST, TOD A.
Exec Dt:
09/06/2001
LLAPITAN, DAVID J.
Exec Dt:
09/06/2001
Assignee:
INTEL CORPORATION
2625 WALSH AVENUE
SANTA CLARA, CALIFORNIA 95051
Correspondent:
SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH PA
ANN M. MCCRACKIN
P.O. BOX 2938
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
030747/0001Recorded: 07/04/2013Pages: 126
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTEL CORPORATION
Exec Dt:
11/22/2011
Assignee:
MICRON TECHNOLOGY, INC.
8000 SO. FEDERAL WAY
BOISE, IDAHO 83716-9632
Correspondent:
MARK V. MULLER
SCHWEGMAN, LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402--0938

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