Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/24/2008
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Application #:
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10155540
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Filing Dt:
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05/24/2002
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Publication #:
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Pub Dt:
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03/13/2003
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Inventors:
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Lin He, Jinlin Peng, Youchun Shi, Brian L. Webb, Po Ki Yuen
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Title:
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MICROCOLUMN-BASED, HIGH-THROUGHPUT MICROFLUIDIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SP-T1-03-1 |
| PATENT DEPARTMENT |
| CORNING, NEW YORK 14831 |
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| CORNING INCORPORATED |
| VINCENT T. KUNG |
| PATENT DEPARTMENT |
| SP-T1-01-1 |
| CORNING, NY 14831 |
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