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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/28/2005
Application #:
10243183
Filing Dt:
09/13/2002
Publication #:
Pub Dt:
03/20/2003
Inventors:
Akihiro Motoki, Shoichi Higuchi, Yoshihiko Takano, Kunihiko Hamada
Title:
METHOD FOR PLATING ELECTRODES OF CERAMIC CHIP ELECTRONIC COMPONENTS
Assignment: 1
Reel/Frame:
013297/0143Recorded: 09/13/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/07/2002
Exec Dt:
08/08/2002
Exec Dt:
08/07/2002
Exec Dt:
08/08/2002
Assignee:
26-10, TENJIN 2-CHOME, NAGAOKAKYO-SHI
MURATA MANUFACTURING CO., LTD. (A170) INTELLECTUAL PROPERTY DEPARTMENT
KYOTO-FU, JAPAN 617-8555
Correspondent:
DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
EDWARD A. MEILMAN
1177 AVENUE OF THE AMERICAS
41ST FLOOR
NEW YORK, NY 10036-2714

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