Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/26/2005
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Application #:
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10223396
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Filing Dt:
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08/20/2002
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Publication #:
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Pub Dt:
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03/27/2003
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Inventors:
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Ichiro Terunuma, Kazuya Akashi, Atsushi Momota
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Title:
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INTERLAYER CONNECTION STRUCTURE OF MULTILAYER WIRING BOARD, METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF FORMING LAND THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, KIBA 1-CHOME, KOHTOH-KU |
| TOKYO, JAPAN |
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| SUGHRUE MION, PLLC |
| PETER D. OLEXY |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20037-3213 |
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