Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10207086
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Filing Dt:
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07/30/2002
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Publication #:
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Pub Dt:
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03/27/2003
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Inventors:
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Wahei Kitamura, Gen Murakami, Kunihiko Nishi
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Title:
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Surface package type semiconductor package and method of producing semiconductor memory
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-1, MARUNOUCHI 2-CHOME |
CHIYODA-KY |
TOKYO, JAPAN |
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ANTONELLI, TERRY, STOUT & KRAUS |
MELVIN KRAUS |
1300 N. SEVENTEENTH ST., STE. 1800 |
ARLINGTON, VA 22209 |
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