Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/19/2003
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Application #:
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09964108
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Filing Dt:
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09/25/2001
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Publication #:
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Pub Dt:
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03/27/2003
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Inventors:
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Ling Chen, Seshadri Ganguli, Christophe Marcadal, Wei Cao, Roderick C. Mosely, Mei Chang
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Title:
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COPPER INTERCONNECT BARRIER LAYER STRUCTURE AND FORMATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEGAL AFFAIRS DEPARTMENT |
| P.O. BOX 450A |
| SANTA CLARA, CALIFORNIA 95052 |
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| APPLIED MATERIALS, INC. |
| ROBERT W. MULCAHY |
| PO BOX 450A, M/S 2061 |
| LEGAL AFFAIRS DEPARTMENT |
| SANTA CLARA, CA 95052 |
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