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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10203790
Filing Dt:
08/14/2002
Publication #:
Pub Dt:
04/10/2003
Inventors:
Inada Teiichi, Keiji Sumiya, Takeo Tomiyama, Keiichi Hatakeyama, Tetsurou Iwakura et al
Title:
Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
Assignment: 1
Reel/Frame:
013355/0326Recorded: 08/14/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/07/2002
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08/07/2002
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08/07/2002
Exec Dt:
08/07/2002
Exec Dt:
08/07/2002
Exec Dt:
08/07/2002
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08/07/2002
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08/07/2002
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08/07/2002
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08/07/2002
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08/07/2002
Exec Dt:
08/07/2002
Assignee:
1-1, NISHI-SHINJUKU 2-CHOME
SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Correspondent:
ANTONELLI TERRY STOUT & KRAUS, LLP
WILLIAM I. SOLOMON
1300 NORTH 17TH STREET
SUITE 1800
ARLINGTON, VA 22209

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