Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10260571
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Filing Dt:
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10/01/2002
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Publication #:
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Pub Dt:
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04/17/2003
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Inventor:
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Hideki Matsuzawa
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Title:
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Leadframe, method of manufacturing the same, and method of manufacturing a semiconductor device using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 711, AZA SHARIDEN, OAZA KURITA, NAGANO-SHI |
| NAGANO, 380-0921, JAPAN |
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| ARMSTRONG, WESTERMAN & HATTORI, LLP |
| WILLIAM G. KRATZ, JR. |
| 1725 STREET, N.W., SUITE 1000 |
| WASHINGTON, D.C. 20006 |
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