Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10271793
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Filing Dt:
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10/17/2002
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Publication #:
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Pub Dt:
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04/17/2003
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Inventors:
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Se Young Lee, Du k Lee
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Title:
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Polishing platen of chemical mechanical polishing apparatus and planarization method using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| JAMES T. ELLER, JR. |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 HYANGJEONG-DONG, HEUNGDUK |
| CHEONGJU CITY, CHUNG CHEONG BOK-DO, KOREA, REPUBLIC OF |
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| MATTHEW T. SMITH |
| DECHERT LLP |
| 4000 BELL ATLANTIC TOWER |
| 1717 ARCH STREET |
| PHILADELPHIA, PA 19103-2793 |
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