Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2006
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Application #:
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10318017
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Filing Dt:
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12/13/2002
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Publication #:
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Pub Dt:
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05/01/2003
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Inventors:
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Noriki Iwasaki, Satoru Fukunaga, Tadayuki Into
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Title:
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METHOD OF THINNING SEMICONDUCTOR WAFER CAPABLE OF PREVENTING ITS FRONT FROM BEING CONTAMINATED AND BACK GRINDING DEVICE FOR SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22-22, NAGAIKE-CHO, ABENO-KU |
| OSAKA, JAPAN 545-5822 |
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| HAROLD BURNAM, JR. |
| 901 NORTH GLEBE ROAD |
| ELEVENTH FLOOR |
| ARLINGTON, VA 22203 |
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