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Patent Assignment Abstract of Title
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Total Assignments: 7
Patent #:
6898848
Issue Dt:
05/31/2005
Application #:
10318246
Filing Dt:
12/13/2002
Publication #:
20030084563
Pub Dt:
05/08/2003
Inventors:
Tatsuyuki Ohkubo, Keisuke Nadamoto, Yoshifumi Katayama
Title:
METHOD OF BONDING INNER LEADS TO CHIP PADS
Assignment: 1
Reel/Frame:
042356/0354Recorded: 05/12/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OHKUBO, TATSUYUKI
Exec Dt:
01/19/1998
NADAMOTO, KEISUKE
Exec Dt:
01/19/1998
KATAYAMA, YOSHIFUMI
Exec Dt:
01/19/1998
Assignees:
HITACHI, LTD.
CHIYODA-KU
TOKYO, JAPAN
HITACHI TOKYO ELECTRONICS CO., LTD.
OME-SHI
TOKYO, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
042453/0172Recorded: 05/12/2017Pages: 25
Conveyance:
MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignors:
HITACHI TOKYO ELECTRONICS CO., LTD.
Exec Dt:
04/01/2003
Newly Merged Entity Data
EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Exec Dt:
04/01/2003
Newly Merged Entity's New Name:
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
14-1, KYOBASHI 2-CHOME, CHUO-KU
TOKYO, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 3
Reel/Frame:
014587/0315Recorded: 10/15/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HITACHI, LTD.
Exec Dt:
09/12/2003
Assignee:
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
JOHN R. MATTINGLY
1800 DIAGONAL RD., SUITE 370
ALEXANDRIA, VA 22314
Assignment: 4
Reel/Frame:
024755/0338Recorded: 07/29/2010Pages: 54
Conveyance:
MERGER AND CHANGE OF NAME
Assignor:
RENESAS TECHNOLOGY CORP.
Exec Dt:
04/01/2010
Assignee:
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668
Correspondent:
MATTINGLY & MALUR, P.C.
1800 DIAGONAL RD.
SUITE 370
ALEXANDRIA, VA 22314
Assignment: 5
Reel/Frame:
042356/0468Recorded: 05/12/2017Pages: 11
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Exec Dt:
10/01/2013
Assignee:
RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
11-3, SHINBASHI 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 6
Reel/Frame:
042484/0880Recorded: 05/12/2017Pages: 24
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Exec Dt:
04/01/2014
Assignee:
RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
1-1, YAHATA 1-CHOME, MINAMI-KU
KUMAMOTO-SHI, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314
Assignment: 7
Reel/Frame:
042609/0807Recorded: 05/12/2017Pages: 13
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Exec Dt:
04/01/2014
Assignee:
RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
1-1, 1-CHOME, YAHATA, MINAMI-KU, KUMAMOTO-SHI
KUMAMOTO, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314

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