Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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10260400
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Filing Dt:
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10/01/2002
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Publication #:
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Pub Dt:
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05/15/2003
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Inventors:
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Seishi Oida, Sigeki Sakaguchi, Koji Ohmori, Kenrou Jitumori
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Title:
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SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGING METHOD, ASSEMBLY AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA |
| KADOMA-SHI, OSAKA 571-8501, JAPAN |
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| NIXON PEABODY LLP |
| DONALD R. STUDEBAKER |
| 8180 GREENSBORO DRIVE, SUITE 800 |
| MCLEAN, VIRGINIA 22102 |
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