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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/04/2003
Application #:
10156180
Filing Dt:
05/29/2002
Publication #:
Pub Dt:
05/15/2003
Inventors:
Young-Hee Mun, Gun Kim, Sung-Ho Yoon
Title:
A METHOD OF FABRICATING A SILICON WAFER INCLUDING STEPS OF DIFFERENT TEMPERATURE RAMMP-UP RATES AND COOL-DOWN RATES
Assignment: 1
Reel/Frame:
012949/0340Recorded: 05/29/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/04/2002
Exec Dt:
05/04/2002
Exec Dt:
05/04/2002
Assignee:
274, IMSOO-DONG
GUMSHI-SHI, KYONGSANGBUK-DO, KOREA, REPUBLIC OF
Correspondent:
JACOBSON HOLMAN PLLC
YOON S. HAM
400 SEVENTH STREET, N.W.
WASHINGTON, D.C. 20004-2218

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