Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/08/2008
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Application #:
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10311476
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Filing Dt:
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12/16/2002
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Publication #:
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Pub Dt:
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05/15/2003
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Inventors:
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Hidenobu Nishikawa, Kazuto Nishida, Kazumichi Shimizu, Shuji Ono, Hiroyuki Otani
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Title:
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ELECTRONIC PARTS PACKAGING METHOD AND ELECTRONIC PARTS PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA 571-8501, JAPAN |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| MICHAEL S. HUPPERT, ESQ. |
| 2033 K STREET, N.W., SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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