Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10291445
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Filing Dt:
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11/07/2002
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Publication #:
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Pub Dt:
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05/22/2003
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Inventors:
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Michio Osada, Ryoji Kitada, Atsushi Hirota
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Title:
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APPARATUS AND METHOD FOR EVALUATING DEGREE OF ADHESION OF ADHERENTS TO MOLD SURFACE, APPARATUS AND METHOD FOR SURFACE TREATMENT OF MOLD SURFACE AND METHOD AND APPARATUS FOR CLEANING MOLD USED FOR MOLDING RESIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5, KAMITOBA KAMICHOSHI-CHO |
| MINAMI-KU, KYOTO-SHI |
| KYOTO, JAPAN |
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| FASSE PATENT ATTORNEYS, PA |
| WALTER F. FASSE |
| PO BOX 726 |
| HAMPDEN, ME 04444-0726 |
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