Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2005
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Application #:
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10027919
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Filing Dt:
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12/20/2001
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Publication #:
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Pub Dt:
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05/22/2003
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Inventors:
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Masaru Seita, Hideki Tsuchida, Shinjiro Hayashi
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Title:
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ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD FOR CONTROLLING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 455 FOREST STREET |
| MARLBOROUGH, MASSACHUSETTS 01752 |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| DIKE, BRONSTEIN, ROBERTS & CUSHMAN GROUP |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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