Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10193576
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Filing Dt:
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07/11/2002
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Publication #:
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Pub Dt:
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05/22/2003
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Inventors:
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Hifumi Nagai, Toshiteru Nonaka
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Title:
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Copper alloy foil
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TECHNOLOGY DEVELOPMENT DEPT. |
| 1-1-2 HAKUGINCHO |
| HITACHI-SHI, IBARAKI-KEN, JAPAN |
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| JORDAN AND HAMBURG LLP |
| C. BRUCE HAMBURG, ESQ. |
| CHANIN BUILDING, SUITE 4000 |
| 122 EAST 43ND STREET |
| NEW YORK, NY 10168 |
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