Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09997941
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Filing Dt:
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11/29/2001
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Publication #:
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Pub Dt:
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05/29/2003
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Inventors:
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Ming-Ta Tei, Chuen-Jye Lin, Hei-Mei Chen
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Title:
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Process of rectifying a wafer thickness
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| 21, R&D 1ST RD., |
| HSINCHU, TAIWAN |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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