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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/13/2005
Application #:
09999169
Filing Dt:
12/03/2001
Publication #:
Pub Dt:
06/05/2003
Inventors:
Vassoudevane LeBonheur, Debendra Mallik, Eduardo J. Bolanos
Title:
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
Assignment: 1
Reel/Frame:
012531/0172Recorded: 01/29/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/09/2002
Exec Dt:
01/17/2002
Exec Dt:
01/16/2002
Assignee:
SC4-202
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95052
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUSE, LLP
JAMES N. DRESSER
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON, VA 22209

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