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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10294325
Filing Dt:
11/13/2002
Publication #:
20030104680
Pub Dt:
06/05/2003
Inventors:
Andrei D. Stefanescu, Leonard O. Rosik, Tina L. Gardner
Title:
PROCESS FOR THE REMOVAL OF COPPER FROM POLISHED BORON-DOPED SILICON WAFERS
Assignment: 1
Reel/Frame:
013964/0378Recorded: 03/19/2003Pages: 23
Conveyance:
SECURITY AGREEMENT
Assignors:
MEMC ELECTRONIC MATERIALS, INC.
Exec Dt:
03/03/2002
MEMC PASADENA, INC.
Exec Dt:
03/03/2002
PLASMASIL, L.L.C.
Exec Dt:
03/03/2002
SIBOND, L.L.C.
Exec Dt:
03/03/2003
MEMC SOUTHWEST INC.
Exec Dt:
03/03/2003
MEMC INTERNATIONAL, INC.
Exec Dt:
03/03/2003
MEMC HOLDINGS CORPORATION
Exec Dt:
03/03/2003
Assignee:
CITICORP USA, INC.
2 PENNS WAY
SUITE 200
NEW CASTLE, DELAWARE 19720
Correspondent:
CLEARY, GOTTLIEB STEEN & HAMILTON
BRIAN CRIST
ONE LIBERTY PLAZA
NEW YORK, NY 10006
Assignment: 2
Reel/Frame:
013733/0178Recorded: 01/31/2003Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
STEFANESCU, ANDREI D.
Exec Dt:
01/17/2003
ROSIK, LEONARD O.
Exec Dt:
01/16/2003
GARDNER, TINA L.
Exec Dt:
01/03/2003
Assignee:
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, P.O. BOX 8
ST. PETERS, MISSOURI 63376-5000
Correspondent:
RICHARD A. SCHUTH, ESQ.
SENNIGER, POWER, LEAVITT & ROEDEL
ONE METROPOLITAN SQUARE, 16TH FLOOR
ST. LOUIS, MO 63102

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