Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10180001
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Filing Dt:
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06/24/2002
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Publication #:
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Pub Dt:
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06/19/2003
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Inventor:
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Chun-Tsai Yang
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Title:
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PRESSING KIT FOR SUBSTRATE OR LEAD FRAME OF A SEMICONDUCTOR PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| N.E.P.Z. |
| 9, CHUNG-SAN ST. |
| KAOHSIUNG, TAIWAN |
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| YANG, CHUN-TSAI |
| PO BOX 82-144 |
| TAIPEI, TAIWAN |
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