Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10033277
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Filing Dt:
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12/17/2001
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Publication #:
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Pub Dt:
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06/19/2003
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Inventors:
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Mark S. Lopac, David R. Backen, Kevin C. Dane, Steve H. Schultz
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Title:
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Multi-layers with vias in filled holes
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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15102 MINNETONKA INDUSTRIAL RD. |
MINNETONKA, MINNESOTA 55345 |
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HONEYWELL INTERNATIONAL INC. |
CURTIS BRUESKE |
PO BOX 2245 |
101 COLUMBIA ROAD |
MORRISTOWN, NJ 07962 |
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