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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/16/2004
Application #:
10318303
Filing Dt:
12/13/2002
Publication #:
Pub Dt:
06/19/2003
Inventors:
Yong Il Kim, Sung Gue Lee, Yu Seock Yang
Title:
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
013581/0022Recorded: 12/13/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/11/2002
Exec Dt:
12/11/2002
Exec Dt:
12/11/2002
Assignee:
20, YOIDO-DONG, YOUNGDUNGPO-KU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
FLESHNER & KIM, LLP
LAURA L. LEE
P.O. BOX 221200
CHANTILLY, VA 20153-1200
Assignment: 2
Reel/Frame:
024272/0606Recorded: 04/22/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/15/2010
Assignees:
20 YEOUIDO-DONG, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 150-721
33RD FLOOR, LG TWIN TOWER WEST, 20 YEOUIDO-DONG, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 150-721
Correspondent:
KED & ASSOCIATES, LLP
P.O. BOX 221200
CHANTILLY, VA 20153-1200

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