Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/17/2006
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Application #:
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10240251
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Filing Dt:
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09/30/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Inventors:
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Masaki Hashimura, Takao Sato, Koichi Ota
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Title:
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METHOD FOR DICING SEMICONDUCTOR WAFER INTO CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, ASA NAGAHATA, OAZA OCHIAI, HARUHI-CHO |
| NISHIKASUGAI-GUN, AICHI, JAPAN 452-8564 |
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| MCGINN & GIBB, PLLC |
| SEAN M. MCGINN, ESQ. |
| 8321 OLD COURTHOUSE ROAD |
| SUITE 200 |
| VIENNA, VA 22182-3817 |
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Assignment:
2
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RECORD TO CORRECT THE ASSIGNEE'S ADDRESS. DOCUMENT PREVIOUSLY RECORDED ON REEL 013843 FRAME 0106. ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.
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| 1, AZA NAGAHATA, OAZA OCHIAI |
| HARUHI-CHO |
| NISHIKASUGAI-GUN, AICHI, JAPAN 452-8564 |
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| MCGINN & GIBB, PLLC |
| SEAN M. MCGINN, ESQ. |
| 8321 OLD COURTHOUSE ROAD |
| SUIE 200 |
| VIENNA, VA 22182-3817 |
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