Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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06/08/2004
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Application #:
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10174462
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Filing Dt:
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06/17/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Inventors:
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Mou-Shiung Lin, Jin-Yuan Lee, Ching-Cheng Huang
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Title:
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INTEGRATED CHIP PACKAGE STRUCTURE USING SILICON SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK HSINCHU |
| HSIN-CHU CITY, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 301/ 302, NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121-1714 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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