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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10339125
Filing Dt:
01/09/2003
Publication #:
Pub Dt:
07/10/2003
Inventors:
Ichiro Suehiro, Noriaki Harada, Yuji Hotta
Title:
Thermally conductive sheet and semiconductor device using same
Assignment: 1
Reel/Frame:
013725/0365Recorded: 02/05/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/08/2003
Exec Dt:
01/08/2003
Exec Dt:
01/08/2003
Assignee:
1-2, SHIMOHOZUMI 1-CHOME
IBARAKI-SHI OSAKA, 567-8680, JAPAN
Correspondent:
LEYDIG, VOIT & MAYER, LTD.
JOHN KILYK, JR.
TWO PRUDENTIAL PLAZA, SUITE 4900
CHICAGO, IL 60601-6780
Assignment: 2
Reel/Frame:
014198/0915Recorded: 06/24/2003Pages: 4
Conveyance:
CORRECTIVE OF PTO ERROR REEL 013725 FRAME 0365
Assignors:
Exec Dt:
01/08/2003
Exec Dt:
01/08/2003
Exec Dt:
01/08/2003
Assignee:
1-2, SHIMOHOZUMI 1-CHOME
IBARAKI-SHI OSAKA, JAPAN 567-8680
Correspondent:
LEYDIG, VOIT & MAYER
JOHN KILYK
TWO PRUDENTIAL PLAZA, SUITE 4900
CHICAGO, IL 60601-6780

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