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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10342298
Filing Dt:
01/15/2003
Publication #:
Pub Dt:
07/24/2003
Inventors:
Takashi Shutou, Yasuhito Takahashi, Kenji Iida, Kenji Takano, Yukio Miyazaki
Title:
Printed circuit board and manufacturing method therefor
Assignment: 1
Reel/Frame:
013661/0786Recorded: 01/15/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/28/2002
Exec Dt:
10/28/2002
Exec Dt:
10/29/2002
Exec Dt:
10/28/2002
Exec Dt:
10/29/2002
Assignee:
1-1, KAMIKODANAKA, 4-CHOME NAKAHARA-KU, KAWASAKI-SHI
KANAGAWA 211-8588, JAPAN
Correspondent:
STAAS & HALSEY LLP
H.J. STAAS
700 ELEVENTH STREET, N.W., SUITE 500
WASHINGTON, D.C. 20001
Assignment: 2
Reel/Frame:
014122/0482Recorded: 05/30/2003Pages: 4
Conveyance:
RE-RECORD TO CORRECT THE THIRD INVENTOR'S LAST NAME AND FOURTH INVENTOR'S DATE. PREVIOUSLY RECORDED AT REEL/FRAME 013661/0786.
Assignors:
Exec Dt:
10/28/2002
Exec Dt:
10/28/2002
Exec Dt:
10/28/2002
Exec Dt:
10/29/2002
Exec Dt:
10/29/2002
Assignee:
1-1, KAMIKODANAKA, 4-CHOME NAKAHARA-KU,
KAWASAKI-SHI
KANAGAWA, JAPAN 211-8588
Correspondent:
STAAS & HALSEY LLP
H.J. STAAS
700 ELEVENTH STREET, N.W., SUITE 500
WASHINGTON, D.C. 20001

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