Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10298228
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Filing Dt:
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11/18/2002
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Publication #:
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Pub Dt:
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07/24/2003
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Inventors:
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Masahiro Nakano, Katsuhiko Gunji, Yasunobu Oikawa, Katsuo Sato
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Title:
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Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-13-1, NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-8272 |
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| MCGINN & GIBB, PLLC |
| SEAN M. MCGINN |
| 8321 OLD COURTHOUSE ROAD |
| SUITE 200 |
| VIENNA, VA 22182-3817 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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