Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10057399
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Filing Dt:
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01/25/2002
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Publication #:
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Pub Dt:
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07/31/2003
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Inventors:
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Mario Merlin, Aldo Torti, Stefano Santi
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Title:
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COMPRESSION ASSEMBLED ELECTRONIC PACKAGE HAVING A PLASTIC MOLDED INSULATION RING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 233 KANSAS STREET |
| EL SEGUNDO, CALIFORNIA 90245 |
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| OSTROLENK, FABER, GERB & SOFFEN LLP |
| SAMUEL H. WEINER |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036-8403 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 25 TAMPINES STREET 92 |
| KEPPEL BUILDING #02-00 528877, SINGAPORE |
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| MURABITO, HAO & BARNES LLP |
| 2 N. MARKET STREET |
| THIRD FLOOR |
| SAN JOSE, CA 95113 |
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