Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10336373
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Filing Dt:
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01/03/2003
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Publication #:
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Pub Dt:
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07/31/2003
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Inventors:
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Harry Hedler, Roland Irsigler, Barbara Vasquez
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Title:
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Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chips
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST.-MARTIN-STR. 53 |
| MUNCHEN, GERMANY |
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| WELSH & KATZ, LTD. |
| GERALD T. SHEKLETON |
| 120 SOUTH RIVERSIDE PLAZA |
| 22ND FLOOR |
| CHICAGO, IL 60606 |
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