Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10337488
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Filing Dt:
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01/07/2003
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Publication #:
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Pub Dt:
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08/07/2003
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Inventors:
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Tetsuaki Suzuki, Shiniti Kazama, Tsuyoshi Sugiyama, Hiroki Kamiya, Noriko Kanemaki et al
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Title:
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Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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14-25 RYOKE 5-CHOME |
KAWAGUCHI-SHI, SAITAMA 332-8533, JAPAN |
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2-27 OTEDORI 3-CHOME |
CHUO-KU, OSAKA-SHI, OSAKA 540-0021, JAPAN |
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COOPER & DUNHAM LLP |
JOHN P. WHITE |
1185 AVENUE OF THE AMERICA |
NEW YORK, NY 10036 |
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