Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10067240
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Filing Dt:
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02/07/2002
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Publication #:
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Pub Dt:
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08/07/2003
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Inventors:
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Takuya Yamamoto, Takashi Kataoka, Yutaka Hirasawa, Naotomi Takahashi
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Title:
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Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO 141-8584, JAPAN |
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| ARENT FOX KINTNER PLOTKIN & KAHN PLLC |
| ROBERT B. MURRAY |
| 1050 CONNECTICUT AVENUE, N.W., SUITE 400 |
| WASHINGTON, D.C. 20036-5339 |
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