Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10320333
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Filing Dt:
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12/16/2002
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Publication #:
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Pub Dt:
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08/14/2003
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Inventors:
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Masao Marunaka, Toshiya Doi, Kouichi Nose, Shirou Takigawa, Kiyoshi Otake
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Title:
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Method and system of forming semiconductor wiring, method and system of fabrication semiconductor device, and wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHINMEIWA-CHO, TAKARAZUKA-SHI |
| HYOGO, JAPAN 665-8550 |
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| 1-15-1, AZUMA TSUKUBA-SHI |
| IBARAGI, JAPAN 305-0031 |
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| 1-24-14, NISHISHINBASHI MINATO-KU |
| TOKYO, JAPAN 105-8418 |
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| MARSHALL, GERSTEIN & BORUN |
| RICHARD H. ANDERSON |
| 6300 SEARS TOWER |
| 233 S. WACKER DRIVE |
| CHICAGO, IL 60606-6357 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-24-14, NISHISHINBASHI |
| MINATO-KU |
| TOKYO 105-8418, JAPAN |
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| MARSHALL, GERSTEIN & BORUN, LLP |
| RICHARD H. ANDERSON |
| 233 S. WACKER DRIVE, SUITE 6300 |
| SEARS TOWER |
| CHICAGO, IL 60606-6357 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHINMEIWA-CHO, TAKARAZUKA-SHI |
| HYOGO, JAPAN 665-8550 |
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| MARSHALL, GERSTEIN & BORUN LLP |
| RICHARD H. ANDERSON |
| 233 S. WACKER DRIVE, SUITE 6300 |
| SEARS TOWER |
| CHICAGO, IL 60606-6357 |
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