Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2007
|
Application #:
|
10305258
|
Filing Dt:
|
11/27/2002
|
|
Publication #:
|
|
Pub Dt:
|
08/21/2003
| | | | |
|
Inventors:
|
Miwa Kozawa, Koji Nozaki, Takahisa Namiki, Ei Yano, Junichi Kon
|
|
Title:
|
RESIST PATTERN THICKENING MATERIAL, RESIST PATTERN AND FORMING PROCESS THEREOF, AND SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
|
|
|
|
| WESTMAN, HATTORI, DANIELS ET.AL. |
| 1250 CONNECTICUT AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20036 |
|
|
Search Results as of:
04/29/2024 07:36 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
