Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10289312
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Filing Dt:
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11/07/2002
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Publication #:
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Pub Dt:
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09/04/2003
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Inventors:
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Fu-Yu Huang, Yu-Chun Huang, Chin-Hui chuang, Ya-Shin Tseng, Chi-Ju Chiang, Che-Chen Chen et al
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Title:
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Method of metal electro-plating for IC package substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9, CHUNG-SAN ROAD |
| N.E.P.Z. |
| KAOHSIUNG, TAIWAN |
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| FU-YU HUANG |
| PO BOX 82-144 |
| TAIPEI, TAIWAN |
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