Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2007
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Application #:
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10400776
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Filing Dt:
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03/27/2003
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Publication #:
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Pub Dt:
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09/11/2003
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Inventor:
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Ikuo Shohji
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Title:
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LEAD-FREE SOLDER POWDER MATERIAL, LEAD-FREE SOLDER PASTE AND A METHOD FOR PREPARING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 ZANKER ROAD |
| SAN JOSE, CALIFORNIA 95134 |
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| ALLSTON L. JONES |
| 425 SHERMAN AVENUE, SUITE 230 |
| PALO ALTO, CA 94306 |
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