Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
08/24/2004
|
Application #:
|
10335294
|
Filing Dt:
|
12/31/2002
|
Publication #:
|
|
Pub Dt:
|
09/11/2003
| | | | |
Inventors:
|
Chih-Jung Ni, Jia-Shing Jan, Yueh-Liang Liu
|
Title:
|
METHOD FOR REMOVING SI-NEEDLES OF WAFER
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO.4 YANSHIN RD. III |
SCIENCE BASED INDUSTRIAL PARK |
HSINCHU,TAIWAN, CHINA R.O.C. 300 |
|
|
|
VOLPE AND KOENING P.C. |
DAMON A. NEAGLE |
SUITE 400, ONE PENN CENTER |
1617 JOHN F. KENNEDY BLVD. |
PHILADELPHIA, PA 19103 |
|
|
Assignment:
2
|
|
|
|
CORRECTIVE DOCUMENT TO CORRECT THE ASSIGNEE NAME REEL 013643, FRAME 0501
|
|
|
|
|
|
NO. 4, YANSHIN 3RD RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. 300 |
|
|
|
VOLPE AND KOENIG, P.C. |
C. FREDERICK KOENIG III |
30 SOUTH 17TH STREET |
PHILADELPHIA, PA 19103 |
|
|
Search Results as of:
05/21/2024 09:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|