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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10375018
Filing Dt:
02/28/2003
Publication #:
Pub Dt:
09/18/2003
Inventor:
Yasuyoshi Horikawa
Title:
Multi-layered semiconductor device and method of manufacturing same
Assignment: 1
Reel/Frame:
013824/0679Recorded: 02/28/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/17/2003
Assignee:
711, AZA SHARIDEN, OAZA KURITA
NAGANO-SHI, NAGANO 380-0921, JAPAN
Correspondent:
STAAS & HALSEY LLP
ATTN: H. J. STAAS
700 11TH STREET, N.W.
SUITE 500
WASHINGTON, DC 20001
Assignment: 2
Reel/Frame:
015143/0604Recorded: 03/26/2004Pages: 5
Conveyance:
RECORD TO CORRECT ASSIGNOR'S NAME ON A DOCUMENT PREVIOUSLY RECORDED AT REEL 013824 FRAME 0679
Assignor:
Exec Dt:
02/17/2003
Assignee:
80 OSHIMADA-MACHI
NAGANO-SHI 381-2287, JAPAN
Correspondent:
STAAS & HALSEY LLP
ATTENTION: H. J. STAAS
700 ELEVENTH STREET, N.W.
SUITE 500
WASHINGTON, D.C. 20001

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