Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/06/2004
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Application #:
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10376110
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Filing Dt:
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02/26/2003
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Publication #:
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Pub Dt:
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09/25/2003
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Inventors:
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Jin-Hyuk Lee, Sa-Yoon Kang, Dong-Whee Kwon, Ji-Yong You, Hye-Soo Shin
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Title:
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REINFORCED BOND-PAD SUBSTRUCTURE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416 MAETAN-DONG, PALDAL-KU, SUWON-CITY |
KYUNGKI-DO, KOREA, REPUBLIC OF |
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MARGER JOHNSON & MCCOLLOM, P.C. |
ALAN T. MCCOLLOM |
1030 S.W. MORRISON STREET |
PORTLAND, OR 97205 |
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