Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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10106728
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Filing Dt:
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03/26/2002
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Publication #:
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Pub Dt:
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10/02/2003
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Inventors:
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Qing Ma, Valluri Rao, John Heck, Michele Berry, Daniel Wong
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Title:
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PACKAGING MICROELECTROMECHANICAL STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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| TROP, PRUNER & HU, P.C. |
| TIMOTHY N. TROP |
| 8554 KATY FREEWAY, SUITE 100 |
| HOUSTON, TX 77024-1841 |
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