Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10400436
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Filing Dt:
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03/28/2003
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Publication #:
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Pub Dt:
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10/02/2003
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Inventors:
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Nobukazu Ito, Akihisa Hongo, Akira Fukunaga, Mizuki Nagai, Ryoichi Kimizuka et al
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Title:
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Method and apparatus for forming fine circuit interconnects
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA, ASAHI-CHO |
| OHTA-KU, TOKYO, JAPAN |
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA, JAPAN |
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| WENDEROTH LIND & PONACK, LLP |
| MICHAEL S. HUPPERT, ESQ. |
| 2033 K STREET, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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